There are two etching methods for PCB: one is inner layer etching; The other is outer etching.

　　The two etching methods for PCB circuit boards are mainly the difference between film negatives. One film is positive and the other film is negative. Positive film for inner layer etching and negative film for outer layer etching.

　　The two PCB etching methods have different operation processes:

　　When a sprayed photosensitive ink is exposed, the parts that do not need to be etched are covered with a film. During the exposure process, the parts that need to be etched are exposed, and then the substrate is exposed after being cleaned by the developer. After curing, the ink that does not need to be etched will adhere to the substrate, maintain it from corrosion, carry out etching processing, and then remove the ink.

　　Another PCB etching process is that the film film maintains the place where etching is required, and the photosensitive ink on the place where etching is not required can withstand corrosion after exposure. The ink on the place to be etched will fall off after being cleaned by the developer, and then be etched.

　　What are the two different etching methods for PCB? Generally speaking, the products processed by inner layer etching generally have large line width and line distance, and ring ring ring is enough; The outer layer etching line is dense and the space is not good. Mingyixin's choice of outer layer etching method can reach the intention of making the line in a bad space.

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